WHO WE ARE
We provide cutting-edge semiconductor design and device integration services, through our industry leading adoption of chiplets. Chiplets are at the forefront of next-gen semiconductor packaging and manufacturing technologies.
WHAT WE DO
Our team is capable of full execution, from initial design to final manufacturing of chiplets, and related advancements, through our established relationships with best in class partners and track record of customer success.
To enable the next generation of advanced semiconductor interconnections by providing innovative solutions in chiplet design through manufacturing.
We are committed to achieving leadership in this critical epoch of packaging technology and taking the centre stage for the next few decades of semiconductor technology scaling in the More-than-Moore era.